KR1280-X3
General-Purpose High-Density 1U 1-Socket Compute Server
- 2x Intel® Xeon® 6
- Supports 2.5″, 3.5″ SAS/SATA/NVMe and E1.S configurations
- Delivers high-density performance and scalability in 1U
- Supports multi-dimensional cooling solutions like EVAC, cold-plate liquid cooling
KR1280-X3 is a 1U 2-socket high-density computing server with 2 Intel® Xeon® 6 processors, featuring the highest TDP in a 1U space. It utilizes multi-dimensional cooling solutions such as EVAC and cold-plated liquid cooling to support high performance density while meeting the low PUE requirements of modern data centers.
Model | KR1280-X3 | |
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Configuration | Standard KR1280-X3-A0-R0-00 |
Front I/O KR1280-X3-A0-F0-00 |
Form Factor | 1U rack server | |
Processor | 1 or 2x Intel ® Xeon® 6 processors, (6500P/6700P-Series 2S/6700E-series), up to 350W TDP, 4x UPI 2.0 | |
Memory | Up to 32x DDR5 DIMMs (6400 MT/s) RDIMMs supported Up to 16x MCR DIMMs (8800MT/s) (GNR) |
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Storage | Front: Option 1: 3.5” LFF – up to 4x 3.5” SAS/SATA/NVMe+4x E3.S SSD Option 2: 2.5” SFF – up to 8/10/12x 2.5” SAS/SATA/NVMe Option 3: 32x E1.S SSD |
Front I/O SKU: Option 1: 4x E3.S SSD (1T/2TB) Option 2: 4×2.5” SAS/SATA/NVMe Option 3: 12x E1.S SSD |
Internal: Up to 1x TF cards Up to 2x SATA M.2 or 2x NVMe M.2 |
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Rear: 2x 2.5” SAS/SATA |
Rear: N/A | |
Expansion Slots | Standard Configuration: Up to 7x PCIe expansion slots, including 2x hot-swap OCP 3.0 slots (Front: 2x PCIe expansion slots; Rear: 3x PCIe and 2x OCP 3.0) |
Up to 7x PCIe expansion slots (Front: 2x PCIe expansion slots and 1x OCP 3.0 slot; Rear: 2x PCIe expansion slots and 2x OCP 3.0 slots) |
Liquid Cooling Configuration: Up to 5x PCIe expansion slots for liquid cooling configuration, and 1x hot-swap OCP 3.0 Slot |
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Network Options | 2x OCP 3.0 x8/x16 | |
Storage Controller | RAID controller and SAS controller IOH controller supports 16x SATA ports Onboard Intel NVMe controller, with optional Intel NVMe RAID key |
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Cooling | Fans: (8) hot-swap Dual Rotor Fans (N+1 Redundant) | |
PSU | (1+1) 800W/1300W/1600W/2000W/2700W/3200W redundant Titanium/Platinum CRPS | |
Security | TPM 2.0, Intel PFR, BMC/BIOS chip-level redundancy, MUPR 3.0 early warning of memory faults | |
Management | ASPEED AST2600 | |
Dimensions | 438mm (W) x 43.05mm (H) x 780mm (D) | |
* Configuration subject to change and is not final