K22V3 with AMD EPYC™ 9005
K22-E3
Highest VM Density in 1-Socket Design

COMING SOON (Q4 2024)

  • 1x AMD EPYC™ 9005 per node, up to 192 cores, supports max TDP with air cooling
  • 12x DDR5 DIMM
  • Up to 12x 2.5″ SSD

K22-E3 is a 2U 2-node server with AMD EPYC™ 9005 delivering single-socket performance up to 500W per node with air cooling. It supports up to 12x 2.5″ SSDs providing power and performance density as well as thermal and energy efficiency.

Optimized for maximum energy savings, it utilizes Extended Volume Air Cooling (EVAC) Heat Sink & HDD backplane to lower fan power expenditure, and Power Capping to achieve machine-level efficiency.

Specifications

K22-E3-A0-R0-00
Node Processor 1x AMD EPYC™ 9005 per node, up to 500W TDP with air cooling
Memory 12x DDR5 DIMMs, 6000MHz @ 1DPC, supports RDIMM
Storage Up to 12x 2.5″ NVMe/SATA SSD, internal 2x M.2
Boot Device 2x 2280/22110 SATA/PCIe x4 M.2
Rear I/O 1x RJ45, 1x UID/RST button, 1x micro USB for debug, 1x micro USB
PCIe Up to 2x PCIe 5.0 x16 HHHL + 2x PCIe 5.0 x8 HHHL
Network Options 1x SFF OCP 3.0 Gen5 x16, supports NCSI
Management AST 2600, IPMI/Redfish
Security Supports TPM 2.0
Chassis Form Factor Dual hot-pluggable systems (nodes) in 2U
Dimensions 447mm (W) x 88.2mm (H) x 880mm (D)
Fan (6) 6056 dual rotor fan, N+1 rotor redundancy
PSU (2) 2000 PSUs (Platinum/Titanium), supports 1+1 redundancy

* Configuration subject to change and is not final