K24-X3
2U 4-Node High-Density Server with Liquid Cooling
COMING SOON (2025)
- up to 2x Intel® Xeon® 6 per node
- Up to 24x DDR5 DIMMs
- Supports cold-plate liquid cooling
K24-X3 is a 2U 4-node server delivering extreme compute density with 4 Intel® Xeon® 6 6900 series processors with up to 128 cores per CPU. It features an energy efficient full cold-plate liquid cooling design to minimize power consumption costs, and supports integrated air-liquid whole cabinet delivery for agile, rapid deployment.
Specifications
| Air Cooled K24-X3-A0-R0-00 |
Liquid Cooled K24-X3-A0-R0-00 |
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|---|---|---|---|
| Node | Processor | 2x Intel® Xeon® 6 6900 series processors (with P-cores), up to 400W TDP with air cooling / 500W TDP with liquid cooling | |
| Memory | 24x DDR5 DIMMs, 6400MHz @ 1DPC DDR5 / 8800MHz @ 1DPC MRDIMM, supports RDIMM, MCRDIMM | ||
| Storage | Option 1: No Drive (No BP) Option 2: 4x 2.5” (15mm) NVMe/SAS/SATA Option 3: 8x 2.5” (7mm) NVMe/SAS/SATA |
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| Boot Device | 2x 2280 SATA/PCIe x4 M.2 | ||
| Rear I/O | 1x RJ45, 1x UID/RST button, 1x micro USB for debug, 1x micro USB | ||
| PCIe | 1x PCIe 5.0 x16 slot + 1x PCIe 4.0 x16 slot | 1x PCIe 5.0 x16 slot | |
| Network Options | 1. 1x SFF OCP 3.0 Gen5 x8, supports NC-SI per node or 2. 2x SFF OCP3.0 Multi-Host Gen4 x16, support NC-SI per system |
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| Management | AST 2600, IPMI/Redfish | ||
| Security | Supports TPM 2.0 | ||
| Chassis | Form Factor | Four hot-pluggable systems (nodes) in 2U | |
| Fan | (4) or (5) 8086 Dual Rotor Fan, N+1 rotor redundancy | ||
| PSU | 4x 2200/2700/3200W PSUs (Platinum/Titanium), supports N+N redundancy | ||
| Dimensions | 447mm (W) x 87mm (H) x 921mm (D) | ||
* Configuration subject to change and is not final