KR2288

2U 8-GPU Fully Liquid-Cooling AI System

Ultra-Dense Peak Performance

The KR2288V3 platform features NVIDIA HGX Rubin NVL8 and is engineered to deliver over 5× performance improvement in FP4 precision inference, targeting next-generation AI workloads that demand extreme efficiency and scalability.

Built on an advanced HBM4 high-bandwidth memory architecture, the platform is optimized for long-context processing, million-token inference, and bandwidth-intensive AI scenarios, ensuring sustained throughput for large-scale generative models.

All components are designed with a rack-level, full liquid-cooling solution, enabling ultra-high density deployment with reduced power consumption and improved thermal efficiency.

Next-Generation HBM4 Architecture

Equipped with HBM4 memory, each GPU operates at up to 2.3 kW, delivering 5× overall performance improvement at NVFP4 precision, optimized for large-scale AI inference workloads.


Modular 1U Liquid-Cooled CPU Architecture

CPU module features a fully liquid-cooled, modular design with upgrade-ready architecture, ensuring seamless platform evolution for future processor generations.


End-to-End Intelligent Liquid Cooling Management

Comprehensive monitoring across node → rack → CDU → intelligent valve, forming a fully integrated, closed-loop smart cooling management system.


Front-Accessible OS Drive with Cold-Swap Support

Front-side OS storage supports cold-swap replacement, improving serviceability and operational availability in large-scale deployments.


Enhanced Security with EROT Protection

Supports EROT (Enhanced Root of Trust) functionality to prevent unauthorized firmware attacks, meeting Zero Trust platform security requirements.

Specifications

Model KR2288-X3
Form Factor 2U rackmount
Processor 2x Intel ® Xeon® 6 processors (6700P-Series)
Memory 32x DDR5-6400 RDIMMs, up to 4TB DDR5 ECC
GPU NVIDIA HGX Rubin 8-GPU
Storage 8x NVMe E1.S + 2x NVMe M.2
PCIe 1x PCIe 6.0 x16 FH3/4L with BF4240L
Network Interface 8x OSFP (IB XDR, ETH 800G) from CX-9
Power 54V Busbar
Cooling In-Rack CDU, In-Row CDU, 34LPM Inlet 45C PG-25
Rear I/O MicroUSB x1, In-Band Management (I210), USB 3.0 x2, Mini DP x1, Out-Of-Band Management
Management ASPEED AST2600 BMC Module
Security TPM 2.0, ERoT
Power Consumption 24KW
Dimensions 448mm (W) x 87mm (H) x 800mm (D)
Weight ~55Kg

Performance & Acceleration

Precision/Metric NVIDIA Rubin (Single GPU)
FP4 Tensor Core 50 PFLOPS (NVFP4)
FP8/FP6 Tensor Core 17.5 PFLOPS
FP16/BF16 Tensor Core 4 PFLOPS
FP32 Tensor Core 130 TFLOPS
FP64/FP64 Tensor Core 33 TFLOPS
INT8 Tensor Core 2 PFLOPS
GPU Memory 288 GB HBM3e
Memory Bandwidth 15 ~20 TB/s
TDP 2,300W per GPU

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